Abstract: In this paper, we report an advanced e-beam defect inspection tool (eProbe®250) and the Design-for-Inspection™ (DFI) system that has been built and
deployed by PDF Solutions down to 4nm FinFET technology nodes. This tool has a very high throughput which allows for in-line inspection of nanometer level defects in the most advanced technology nodes. We also present eProbe applications for detection of systematic buried defects and process window characterization.
Keywords: e-beam Inspection, FinFET, Yield